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| USPN-6B01 ? / packaging information ? packaging information / ?` reference pattern layout dimensions unit : inch (mm) ??? / reference metal mask design ?`? / reference pattern layout
USPN-6B01 ` /reel ?`?? /taping specifications ?`?? / ta p in g s p ecifications 5,000pcs/reel USPN-6B01 power dissipation power dissipation data for the USPN-6B01 is shown in this page. the value of power dissipation varies with the mount board conditions. please use this data as one of reference data taken in the described condition. 1. measurement condition (reference data) condition : mount on a board ambient : natural convection soldering : lead (pb) free board : dimensions 40mm x 40 mm (1600mm2) copper (cu) traces occupy 50% of the front and 50% of the back. vss pin is tied to the copper traces material : glass epoxy fr-4 thickness : 1.6mm through-hole : 4 x 0.8 diameter 2. power dissipation vs. ambient temperature board mount ( tjmax=125) ambient temperature ( ) power dissipation pd (mw) thermal resistance ( /w 25 600 166.67 85 240 evaluation board (unit: mm) |
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